gainst MediaTek’s Dimensity 1200 processor. Both chipsets are expected to be the SoC for phones that fall under the flagship killer category, so it makes sense to see how they compare against each other. The table below shows a spec-by-spec comparison:

Snapdragon 870 5G Dimensity 1200

Node size 7nm.              6nm

CPU 1 x ARM Cortex-A77 at 3.2GHz

3 x ARM Cortex-A77 at 2.42GHz

4 x ARM Cortex-A55 at 1.8GHz 1 x ARM Cortex-A78 at 3.0 GHz

3 x ARM Cortex-A78 at 2.6GHz

4 x ARM Cortex-A55 at 2.0GHz

GPU Adreno 650 ARM Mali-G77 MC9 (9 cores, Boosted)

ISP Spectra 480

Supports up to 200MP

Supports 4K video capture

Supports 8K video capture MediaTek Imagiq Camera

(five-core) HDR-ISP

Supports up to 200MP

Supports 4K HDR video capture

AI Engine Hexagon 698

(15 TOPS) MediaTek APU 3.0 (six cores)

Max On-Device Display and Refresh Rate QHD+ at 144Hz

4K at 60Hz QHD+ at 90Hz

FHD+ (2520 x 1080) at 168Hz

Modem Snapdragon X55

Supports mmWave and sub-6GHz spectrums

Multi-SIM features: Global 5G multi-SIM

5G Uplink Speed: Up to 3 Gbps

5G Downlink Speed: Up to 7.5 Gbps Helio M70

Supports sub-6GHz

Multi-SIM features: True Dual 5G SIM (5G SA + 5G SA)

5G Uplink Speed: Up to 2.5 Gbps

5G Downlink Speed: Up to 4.7 Gbps

Connectivity Wi-Fi 6

Bluetooth 5.2

GPS, GLONASS, NavIC, Galileo, Beidou, QZSS Wi-Fi 6

Bluetooth 5.2 with LC3 encoding

Dual Frequency GPS, GLONASS, NavIC, Galileo, Beidou, QZSS

Gaming Snapdragon Elite Gaming

Qualcomm Game Color Plus v2.0

Qualcomm Game Smoother

True HDR game rendering

10-bit color depth

2020 color gamut

Updateable GPU drivers HyperEngine 3.0

Networking Engine 3.0

Rapid Response Engine 3.0

PQ Engine 3.0 (Ray Tracing in Mobile Games and AR)

Resource Management Engine